Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
659810 | International Journal of Heat and Mass Transfer | 2011 | 7 Pages |
Abstract
In this study, the effects of various chip thicknesses on the chip hot spot temperature are investigated using both experimental and analytical methods. The temperature distribution in the chip is measured under the various chip thicknesses (21.5–400 μm) and various heater power conditions (0.2–0.5 W). In order to support the experimental data and gain a physical insight, closed-form analytic expressions are suggested. Based on the suggested analytic expressions, the effects of the nondimensional contact radius, nondimensional substrate thickness, and the Biot number are investigated.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Chan Byon, Kyosung Choo, Sung Jin Kim,