Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6601840 | Electrochimica Acta | 2018 | 6 Pages |
Abstract
Fe-P, Ni-P and Ni-Fe-P alloys were prepared by galvanostatic electrodeposition over copper electrodes in aqueous media in order to obtain a corrosion resistant layer. All electrodeposits were prepared in optimized conditions at acidic medium (pHâ¯<â¯2.0), using 80â¯mAâ¯cmâ2 for Fe-P and Ni-P alloys and 60â¯mAâ¯cmâ2 for Ni-Fe-P alloy at 55â¯Â°C. The morphology of the electrodeposits was evaluated by scanning electron microscopy, which revealed a nodular, hemispheric grains in Ni-P and Ni-Fe-P alloys and the same grains with cracks in Fe-P alloy. X-ray diffraction (XRD) measurements showed characteristic peaks for Fe and Ni, and P incorporation was observed due to characteristic peak at 2θâ¯ââ¯50°, which means that P atoms amorphized the structure of the electrodeposits. Energy Dispersive X-Ray Spectroscopy (EDS) measurements showed the following composition for all alloys (mass percentage): Fe91.1%-P4.3%, Ni88.5%-P9.7%, Ni46.5%-Fe39.4%-P12.6%. Linear potentiodynamic polarization showed the following order for crescent nobility corrosion potential: Ecorr (Fe-P)â¯<â¯Ecorr (Ni-P)â¯<â¯Ecorr (Ni-Fe-P). Although Ni-P presented lower anodic current values than Ni-Fe-P in polarization curves, the analysis of E-Ecorr polarization curves in these studies showed that Ni-Fe-P and Fe-P coatings had the lowest and highest anodic current values, respectively, among the three electrodeposits. The same trend was observed in electrochemical impedance spectroscopy when a nested circuit for two capacitance events was applied, having Ni-Fe-P layer the highest polarization resistance value among the three and Fe-P the lowest polarization resistance, showing the viability of anticorrosion properties of Ni-Fe-P layers.
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Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
Henrique J.M. Soares, Othon S. Campos, Diego F. Dias, Paulo N.S. Casciano, Pedro de Lima-Neto, Adriana N. Correia,