Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6603452 | Electrochimica Acta | 2018 | 32 Pages |
Abstract
In this paper, a novel method combining etching and hydrothermal treatment was used to design the superhydrophobic surface on the copper substrates. The contact angle of the superhydrophobic surface was 157.7â¯Â±â¯1°. The superhydrophobic surface showed the corrosion inhibition efficiency of 99.81% in 3.5â¯wt% NaCl aqueous solution. Besides, the superhydrophobic surface showed a good stability in simulated seawater and humid air. In addition, the formation mechanism of copper superhydrophobic surface was analyzed based on the results of SEM, XRD and XPS.
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Authors
Yunxiao Wan, Mojing Chen, Wei Liu, XiXun Shen, Yulin Min, Qunjie Xu,