Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6610529 | Electrochimica Acta | 2015 | 4 Pages |
Abstract
A new acetamide based eutectic solvent is obtained via complexation with AlCl3. The electrodeposition of aluminum is successfully achieved from AlCl3/acetamide eutectic solvent. The cyclic voltammograms on tungsten electrode indicate that Al(III) are easier to be reduced from AlCl3/acetamide eutectic solvent at a molar ratio in a range of 1.1 to 1.5. Aluminum coatings were prepared at â0.25 V (vs. Al/Al3+) and different temperatures at 313 K and 333 K in AlCl3/acetamide eutectic solvent at molar ratio = 1.3 (r = 1.3). The SEM images show that thick adherent aluminum films were deposited on the copper substrate. The EDS and XRD analysis confirm that the obtained deposits are pure aluminum. The present results allowed the new and cheap AlCl3/acetamide eutectic solvent to be a potential electrolyte for aluminum electrodeposition at room temperature.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
Min Li, Bingliang Gao, Chengyuan Liu, Wenting Chen, Zhongning Shi, Xianwei Hu, Zhaowen Wang,