| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6611194 | Electrochimica Acta | 2015 | 23 Pages |
Abstract
Enhancement of hole-transfer across CuSe electrode/liquid junction can be facilitated by coating with metalloporphyrin complexes embedded inside polyethylene matrices.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
Ahed Zyoud, Rola S. Al-Kerm, Rana S. Al-Kerm, Waseem Mansur, Mohammed H.S. Helal, DaeHoon Park, Guy Campet, Nordin Sabli, Hikmat S. Hilal,