| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6618207 | Electrochimica Acta | 2013 | 9 Pages |
Abstract
⺠Using Safranine T as a comparison to study the mechanism of JGB in the through-hole electroplating. ⺠Quantum chemical calculation is employed to analysis electronic properties and orbital information of levelers in the present paper. ⺠Finding out the probable reactive site for the adsorption of JGB on the copper surface. ⺠Offering some theoretical information to design and synthesize new additives for electroplating.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
Chong Wang, Jinqiu Zhang, Peixia Yang, Maozhong An,