| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6618345 | Electrochimica Acta | 2012 | 5 Pages |
Abstract
⺠Copper electroplating on Ta surface from a “single” alkaline injected bath is being described. ⺠Adhered copper electrodeposited film over a thin TaN/Ta barrier was achieved. ⺠Copper filling is demonstrated in nano-features.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Chemical Engineering (General)
Authors
David Starosvetsky, Nina Sezin, Yair Ein-Eli,