Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
661872 | International Journal of Heat and Mass Transfer | 2006 | 7 Pages |
Abstract
An active cooling substrate (ACS) is a microelectro mechanical system (MEMS) device which implements the synthetic jet concept into printed wiring board (PWB) to enhance thermal management. This paper presents a numerical approach to solve the synthetic jet fluid mechanics and heat transfer problem. Fluent, a computational fluid dynamics (CFD) package, is utilized to perform the three-dimensional (3-D), unsteady, and double precision simulations. The large eddy simulation (LES) is selected as the turbulence model. The simulation results are consistent with the experimental data. A numerical predictive model is developed for future designs of synthetic jet based active cooling substrates.
Keywords
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Yong Wang, Guang Yuan, Yong-Kyu Yoon, Mark G. Allen, Sue Ann Bidstrup,