Article ID Journal Published Year Pages File Type
661872 International Journal of Heat and Mass Transfer 2006 7 Pages PDF
Abstract

An active cooling substrate (ACS) is a microelectro mechanical system (MEMS) device which implements the synthetic jet concept into printed wiring board (PWB) to enhance thermal management. This paper presents a numerical approach to solve the synthetic jet fluid mechanics and heat transfer problem. Fluent, a computational fluid dynamics (CFD) package, is utilized to perform the three-dimensional (3-D), unsteady, and double precision simulations. The large eddy simulation (LES) is selected as the turbulence model. The simulation results are consistent with the experimental data. A numerical predictive model is developed for future designs of synthetic jet based active cooling substrates.

Related Topics
Physical Sciences and Engineering Chemical Engineering Fluid Flow and Transfer Processes
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