Preparation of copper coated tungsten powders by intermittent electrodeposition

Copper-coated tungsten (W@Cu) powders were successfully fabricated using our designed device through intermittent electrodeposition. The composite powders in the bath could be effectively prevented from agglomeration by controlling proper stirring frequency and current density. Homogeneously distributed W@Cu powders with a copper coating thickness of ~ 2.5 μm and with copper content of ~ 54 wt.% were fabricated.