Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
668064 | International Journal of Thermal Sciences | 2015 | 6 Pages |
Abstract
Due to their high intrinsic axial thermal conductivity, carbon nanotube (CNT) arrays have generated much interest as next generation thermal interface materials. A significant barrier in their future use is CNT-substrate thermal boundary resistance. For this reason much research has been done in examining improved array adhesion methods. This paper models the thermal resistance of a novel interface structure which shows promise in achieving low thermal resistance and high mechanical compliance. Through the use of a thermal conductive adhesive attachment, overall thermal resistances below 1Â mm2Â KWâ1 can potentially be achieved using a vertically aligned CNT array, which will enable development of future high performance electronic packages.
Keywords
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Andrew J. McNamara, Yogendra Joshi, Zhuomin M. Zhang,