| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 669342 | International Journal of Thermal Sciences | 2008 | 14 Pages |
Abstract
A numerical study is conducted to evaluate the thermal characteristics of a PCM-based heat sink which can be potentially used for cooling of mobile electronic devices such as personal digital assistants (PDAs) and notebooks. The heat sink consists of a conventional, extruded aluminum sink embedded with appropriate PCMs. Some important parameters, such as PCM volume fraction, temperature difference, aspect ratio, and PCM properties, were studied to investigate their effects on the thermal performance of the hybrid cooling system.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Xiang-Qi Wang, Christopher Yap, Arun S. Mujumdar,