Study of the production process of 3-layer sugarcane-bamboo-based particleboards

This study evaluated the technical viability and performance of two different production processes of 3-layer sugarcane-bamboo-based particleboard (3LP) (3LP-PL: pressing in each layer; and 3LP-NPL: non-pressing in each layer) throughout their thermal, physical, mechanical and microstructural properties. The thermal conductivity was determined according to the methodology established by ASTM-E1530: 2011. Physical and mechanical properties were evaluated following the ABNT NBR 14810:2013 Brazilian Standards recommendations. Microstructural properties of the 3LP studied was assessed by using the Micro-CT technique. Thermal conductivity values of both 3LP were lower than the value required by Brazilian Standards for wood-based particleboards. Physical results indicated that the non-pressing in each layer during the 3LP production resulted in less thickness swelling (TS) and water absorption (WA). Modulus of rupture (MOR) and modulus of elasticity (MOE) of the 3LP-NPL showed an increase of 38 and 29% compared to the 3LP-PL respectively. Additionally, an increase of 31% was found for the internal bond (IB) value of the 3LP-NPL compared to the 3LP-PL. Considering the results achieved for the 3-layer sugarcane-bamboo-based particleboard the non-pressing in each layer during production presented lower TS and WA values and higher MOR, MOE and IB values.