| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 671812 | Particuology | 2016 | 5 Pages |
Abstract
- UFP microcapsules with paraffin core and urea-formaldehyde shell were electroless-plated by copper.
- The lowest infrared emissivity achieved by electroless copper plating was 0.68.
- UFP with copper mass increase of 300% had balanced infrared emissivity and phase-change enthalpy.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Xi Zhou, Jian Mao, Zhen Qiao,