Numerical analysis of a micro-encapsulated PCM wallboard: Fluxmeter applications

In this paper, the thermal behavior of a micro-encapsulated phase change material wallboard is numerically investigated. A physical model coupling the heat transfer inside the wallboard with the heat transfer and the phase change process within micro-encapsulated phase change material (PCM) is introduced. The effect of different parameters such as the heating/cooling rate and the mass fraction of the PCM on the thermal behavior of the wallboard is evidenced. Simulation results are used to determine the variation of temperature and liquid fraction of the PCM and quantify heat fluxes exchanged between the two lateral sides of the wallboard. The physical model presents a methodology to determine the thermophysical properties of materials containing phase change materials (PCM).