Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds

Standard enthalpies of formation were determined for a number of binary intermetallic compounds in the systems Ag–Sn, Cu–Sn, and Ni–Sn by means of solution calorimetry in liquid Sn in a Calvet-type microcalorimeter. For the pure elements Ag, Cu, and Ni, the limiting partial enthalpies of mixing as well as the enthalpies of solution at infinite dilution in Sn were measured at 773, 873, 973 and 1073 K. The results for the enthalpy of formation for the intermetallic compounds Ag3Sn, Ag4Sn, Cu3Sn, Cu41Sn11, Cu6Sn5, Ni3Sn-LT, Ni3Sn2-HT, and Ni3Sn4 are discussed and compared with the corresponding literature values.