Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7054232 | International Journal of Heat and Mass Transfer | 2018 | 13 Pages |
Abstract
This study implies experimental investigation for optimization of heat transfer in electronic integrated circuits using close packed phase change materials (PCMs) filled pin-fin heat sinks. The aim of this study is to find the most efficient pin-fin configuration filled with optimum PCM to extend the operating range of electronic circuits. The experimental methodology is based upon variation of pin-fin configurations in rectangular, round and triangular cross-sections. Each configuration is allowed a pin-fin volumetric percentage of 9%. For analysis using PCM a volume fraction of 90% is maintained and six PCMs with different thermo-physical properties (varying melting temperatures, latent heats and heat capacities) are selected. These include paraffin wax, RT-54, RT-44, RT-35HC, SP-31 and n-eicosane. Moreover, the power levels mimicking heat input range between 5â¯W and 8â¯W. The resulting information is analyzed for the performance of a heat sink with and without PCM. Besides that, PCM ascendency is manipulated in terms of operational time, enhancement ratios, Stefan number and storage ratio. The outcomes suggest that triangular pin-fins are found to be the most effective pin-fin configuration for heat transfer both with and without PCM.
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
Hafiz Muhammad Ali, Muhammad Junaid Ashraf, Ambra Giovannelli, Muhammad Irfan, Talal Bin Irshad, Hafiz Muhammad Hamid, Faisal Hassan, Adeel Arshad,