Heat transfer characteristics in wake region of a single finned obstacle

The development of the electronic components is limited due to the maximum allowable chip operating temperature. Therefore, the heat transfer from a heated plate placed behind unfinned and finned obstacle in a rectangular duct is investigated numerically using ANSYS Fluent 14.0. In the current study, unfinned and finned obstacle are used, in order to test the effect of fin size and number of fins on heat transfer from the heated plate. In addition, two different heated plate positions (horizontal and vertical) are studied. During the study the effect of separation between the obstacle and the plate are studied at Reynolds number ranges from 3000 to 9000 and dimensionless separation number, P, ranging from 1.92 to 9.78. The average Nusselt number is used as a key parameter to evaluate the heat transfer characteristics. The numerical solutions obtained reveal how an increased number of fins in obstacle leads to reduction in heat transfer from a heated plate in the wake flow region.