| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7061027 | International Journal of Thermal Sciences | 2013 | 13 Pages |
Abstract
⺠Creep causes stress redistribution leading to major electric potential redistribution. ⺠Electric potential histories can be used for condition monitoring of smart disks. ⺠Destructive or non-destructive testing can be avoided using FGPM smart disks.
Keywords
Related Topics
Physical Sciences and Engineering
Chemical Engineering
Fluid Flow and Transfer Processes
Authors
A. Loghman, M. Abdollahian, A. Jafarzadeh Jazi, A. Ghorbanpour Arani,