| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7117332 | Materials Science in Semiconductor Processing | 2018 | 7 Pages |
Abstract
Cu-based solution/ink coated sulphides have gained tremendous interest in last few years for low-cost solar cells. In this paper, pure copper tin sulphide films have been directly-coated from two different types of molecular solution inks developed with ethylene glycol and ethylene glycol - isopropyl alcohol mixture. Structural, compositional and microstructural properties of direct-coated films were studied and compared. The formation of pure tetragonal copper tin sulphide is confirmed by X-ray diffraction and Raman spectroscopy analysis. Overall it is found that films deposited from ethylene glycol - isopropyl alcohol mixture (glycoholic ink) are comparatively smoother and denser. An X-ray photoelectron study confirms the presence of Cu+ state in the films. The films are photoconducting and show p-type conduction. In general, microstructure of the films was found to depend upon type of solvents.
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Authors
Prashant R. Ghediya, Tapas K. Chaudhuri, Vidur Raj, Dipankar Chugh, Kaushal Vora, Li Li, Hark Hoe Tan, Chennupati Jagadish,