Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7117588 | Materials Science in Semiconductor Processing | 2018 | 7 Pages |
Abstract
Efforts to directly printing nanoscale patterns by electrohydrodynamic jet for demanding device applications in electronics, medicine, and biotechnology have grown rapidly in recent years. However, printing of nano-patterns significantly depends on the fabrication of nanoscale nozzles. Here, we describe a low-cost and concise method for fabrication of SU-8 nano-nozzles only based on traditional UV photolithography. By this method, thermal and volume-shrinkage induced nanoscale crack can be automatically formed due to stress release after developing step. The influence of material, SU-8 layer thickness, and exposing duration on the stress in the SU-8 layer was analyzed to fabricate straight and long nano-crack. The result shows that the suitable material, SU-8 layer thickness, and exposing duration are silicon, 70â¯Âµm, and 46â¯s, respectively. Under the optimized condition, 60â¯Âµm long nano-crack with width of 250â¯nm and depth of 20â¯nm can be fabricated. The fluorescence image demonstrates the absence of blocking and leakage over the entire nano-crack.
Keywords
Related Topics
Physical Sciences and Engineering
Engineering
Electrical and Electronic Engineering
Authors
Jili Wang, Zhifu Yin,