Article ID Journal Published Year Pages File Type
7117915 Materials Science in Semiconductor Processing 2018 7 Pages PDF
Abstract
The structural changes observed near the metal/AlGaN interface can be responsible for this electrical modification deduced by TLM analyses. As a matter of fact, two-dimensional TCAD simulation confirmed that the sheet resistance under the contact and the two-dimensional current distribution are affected by the electrical properties of the alloyed metal/semiconductor interface.
Related Topics
Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
Authors
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