Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7117915 | Materials Science in Semiconductor Processing | 2018 | 7 Pages |
Abstract
The structural changes observed near the metal/AlGaN interface can be responsible for this electrical modification deduced by TLM analyses. As a matter of fact, two-dimensional TCAD simulation confirmed that the sheet resistance under the contact and the two-dimensional current distribution are affected by the electrical properties of the alloyed metal/semiconductor interface.
Related Topics
Physical Sciences and Engineering
Engineering
Electrical and Electronic Engineering
Authors
Monia Spera, Cristina Miccoli, Raffaella Lo Nigro, Corrado Bongiorno, Domenico Corso, Salvatore Di Franco, Ferdinando Iucolano, Fabrizio Roccaforte, Giuseppe Greco,