Article ID Journal Published Year Pages File Type
7118185 Materials Science in Semiconductor Processing 2018 5 Pages PDF
Abstract
The impact of aluminum carbide (Al4C3) at the metal/silicon-carbide (SiC) interface is presented here with respect to 4H-SiC Schottky barrier diodes (SBDs). A post-annealing process at a high temperature (1000 °C) has been employed for the reaction between the aluminum and the carbon. The current density of the fabricated device was measured as ~ 13.4 A/cm2 at 5 V with a leakage current density of less than ~ 6.84 × 10−9 A/cm2 at − 5 V. The thermal-activation energy (EA = 0.35 eV) extracted from the Arrhenius plot decreased by ~ 37% via the formation of the Al4C3. According to the experiment results, the sample with the Al4C3 layer yields a rectification ratio of 1.95 × 109 that is 33 times higher than that of the reference SBDs. The structural defects of the SiC interface may be available for the formation of the Al4C3 layer.
Related Topics
Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
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