Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7125720 | Measurement | 2014 | 7 Pages |
Abstract
In this paper, a mechanic model is developed for the stiffness and stress of a 3D micro tactile sensor for 3D dimensional metrology of micro structure, which is validated by the finite element analysis (FEA). The design parameters of the sensor have been investigated using ANSYS. Some experiments by integrating the sensor with a 3D dimensional metrological positioning platform are performed to validate the design, which shows 5 nm and 10 nm resolution in z and x/y direction respectively, working range of 4.7 μm and cross talk of 0.5%.
Related Topics
Physical Sciences and Engineering
Engineering
Control and Systems Engineering
Authors
Lihua Lei, Linjuan Deng, Guofang Fan, Xiaoyu Cai, Yuan Li, Tongbao Li,