In-situ SEM investigation of sub-microscale deformation fields around a crack-tip in silicon

► The sub-microscale silicon pillars grating was fabricated using holographic lithography followed by inductively coupled plasma etching. ► A combination of in-situ scanning electron microscopy and geometric phase analysis was used to study the deformation fields around a crack-tip in single-crystal silicon under tensile load. ► Strain measurement results were compared with the linear elastic fracture mechanics solutions.