Passive and chipless packaged transducer for wireless pressure measurement

A new microwave fully passive, chipless and packaged sensor for wireless pressure monitoring in harsh environments (such as, extreme temperature, radioactive and/or toxic environments) is proposed in this paper. The sensor consists of a planar microstrip resonator, which is electromagnetically coupled with a high resistivity and thin silicon membrane. Prototypes have been designed and fabricated using a photoresist intermediate layer for the silicon membrane bonding. The electromagnetic simulation of the system is also performed in order to predict the transducer performances. Measurement results using the packaged sensor are provided to experimentally validate the simulation results and the manufacturing process.