Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7133336 | Sensors and Actuators A: Physical | 2018 | 9 Pages |
Abstract
Hermetic packaging plays an important role for optimizing the functionality and reliability of a wide variety of micro-electro-mechanical systems (MEMS). In this paper, we propose a low-temperature wafer-level hermetic packaging method based on the thermo-compression bonding process using an electroplated Cu sealing frame planarized by a single-point diamond mechanical fly-cutting. This technology has an inherent possibility of hermetic sealing and electrical contact as well as a capability of integration of micro-structured wafers. Hermetic sealing can be realized with the sealing frame as narrow as 30â¯Î¼m at a temperature as low as 250â¯Â°C. At such a low bonding temperature, a less amount of gases is desorbed, resulting in a sealed cavity pressure lower than 100â¯Pa. The leak rate into the packages is estimated by a long-term sealed cavity pressure measurement for 7 months to be less than 1.67â¯Ãâ¯10â15â¯Paâ¯m3â¯sâ1. In addition, the bonding shear strength is also evaluated to be higher than 100â¯MPa.
Keywords
Related Topics
Physical Sciences and Engineering
Chemistry
Electrochemistry
Authors
Muhammad Salman Al Farisi, Hideki Hirano, Shuji Tanaka,