Cost effective MEMS fabrication of a nanowire characterization platform with solder coated electrodes

These challenges have given rise to the study presented in this paper. A new method for silicon microstructuring, based on direct silicon laser ablation is proposed. To improve surface quality of the laser-ablated areas, chemical post-processing is implemented in addition to the laser ablation. Additionally the development of low temperature indium based solders is reported in detail, with the aim to employ automatic formation of individual solder contacts on a micron spacing. For this purpose, the measurement electrodes are covered with our proposed low temperature solder through an adapted physical vapor deposition (PVD) and lift off process.