Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
713494 | III-Vs Review | 2006 | 4 Pages |
Abstract
One of the buzzwords currently in use across the semiconductor industry is “three-dimensional integration,” which sounds as though it is a new, beefed-up form of miniaturization. Indeed, 3-D integration does involve further miniaturization, generally by including the z-axis along with the x- and y-axes. But the term also has a deeper and more important connotation: higher speed through the replacement of long wires with shorter pathways.
Related Topics
Physical Sciences and Engineering
Engineering
Electrical and Electronic Engineering
Authors
Keith Gurnett, Tom Adams,