Wafer-level capping and sealing of heat sensitive substances and liquids with gold gaskets

This paper reports on a novel wafer-level packaging method employing gold gaskets and an epoxy underfill. The packaging is done at room-temperature and atmospheric pressure. The mild packaging conditions allow the encapsulation of sensitive devices. The method is demonstrated for two applications; the wafer-level encapsulation of a liquid and the wafer-level packaging of a photonic gas sensor containing heat sensitive dye-films.