Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7150218 | Solid-State Electronics | 2018 | 23 Pages |
Abstract
We have fabricated and characterized Lgâ¯=â¯0.5â¯Î¼m In0.52Al0.48As/In0.7Ga0.3As pseudomorphic high-electron-mobility-transistors (PHEMTs) on a 3-inch InP substrate. Stepper-based photo-lithography was used in all the process steps for device fabrication, aiming to miniaturize key device geometries, such as gate-to-source and gate-to-drain spacing. The fabricated device with Lgâ¯=â¯0.5â¯Î¼m exhibits an excellent maximum transconductance (gm_max) of 1.9â¯S/mm at VDSâ¯=â¯1.5â¯V and an ON-resistance (RON) of below 0.4â¯Î©-mm. A high value of gm in our device leads to a fantastic combination of current-gain cut-off frequency (fT) of 120â¯GHz and maximum oscillation frequency (fmax) of 366â¯GHz at VDSâ¯=â¯0.8â¯V. These remarkable characteristics stem from the compact geometry design of the In0.52Al0.48As/In0.7Ga0.3As PHEMTs with LGSâ¯=â¯LGDâ¯=â¯0.4â¯Î¼m, coupled with an optimized gate recess process that yields tight control of side-recess spacing (Lside). More importantly, the product of fT and Lg in this work yields 60â¯GHz-μm which is the highest in any field-effect-transistor (FET) technology on any material system.
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Electrical and Electronic Engineering
Authors
Ji-Min Baek, Seung-Woo Son, Jung Ho Park, Jong-Keun Park, Jeong-Geun Kwak, Jacoby Yoon, Dong-Soo Bang, Jung-Hee Lee, Taewoo Kim, Dae-Hyun Kim,