Article ID Journal Published Year Pages File Type
7150315 Solid-State Electronics 2018 4 Pages PDF
Abstract
In this paper, a new metal-insulator-metal (MIM) antifuse was fabricated with the high κ Al2O3 deposited by atomic layer deposition (ALD) as the dielectric. On this high κ antifuse structure, the very low on-state resistance was obtained under certain programming conditions. It is the first time that the antifuse on-state resistance has been found decreasing along with the increase of dielectric film thickness, which is attributed to a large current overshoot during breakdown. For the device with a dielectric thickness of 12 nm, very large overshoot current (∼60 mA) was observed and extremely low on-state resistance (∼10 Ω) was achieved.
Related Topics
Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
Authors
, , , ,