Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7169840 | Engineering Fracture Mechanics | 2014 | 11 Pages |
Abstract
A specimen size effect on the adhesion strength of Cu/insulation layer interface was studied by means of a new elastic-plastic finite element simulation technique. By considering the influence of the plastic zone at the interface crack tip, the adhesion strength appeared almost independent of the specimen size. Since the Cu crystals were far smaller than the specimen dimensions and thus no significant difference should be expected in adhesion strength, it is speculated that an accurate estimation of the plastic zone is essential for micro-scale specimen evaluation.
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Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
Chuantong Chen, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Masaki Omiya, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa,