Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7170036 | European Journal of Mechanics - A/Solids | 2019 | 11 Pages |
Abstract
Within the framework of the non-Fourier heat conduction law, this paper presents a transient, frictional thermal analysis with heat generated by a sliding punch acting on the surface of a functionally graded piezoelectric strip (FGPS). A continuous variation in the thickness direction is adopted for the material properties of the piezoelectric strip. By using the Laplace and Fourier integral transform techniques and the superposition principle, general solutions of the thermal field, and homogeneous solutions for both real and complex eigenvalues and particular solutions for the electro-elastic field are given. Results in the time-domain are obtained by applying the numerical Laplace-transform inversion method, and the convergence behavior is analyzed. Numerical results demonstrate that the thermal relaxation effect makes the results of the non-Fourier heat conduction model reach their peak values later than those of the Fourier model. The effects of the punch velocity, the friction coefficient, and various gradient parameters on the contact stress and the surface heat flow are revealed in details.
Related Topics
Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
Yue-Ting Zhou, Chuanzeng Zhang, Zheng Zhong, Lihua Wang,