Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7171006 | International Journal of Adhesion and Adhesives | 2018 | 5 Pages |
Abstract
The adhesive benefits of incorporating shape memory polymers (SMPs) in various dry adhesive designs have been well documented in recent years. Chemically-crosslinked SMPs can possess remarkable shape fixity and recovery ability, chemical and thermal stability, a sharp glass transition, and other desirable qualities. However, low failure strain and a relatively rigid rubbery state limit their performance as a dry adhesive component in many practical applications. This work explores the adhesive benefits of using an epoxy-based SMP which has been modified to possess a softer rubbery state and a greatly increased maximum strain before failure. One of the modified SMPs forms the active adhesive surface of a prototype consumer level device.
Related Topics
Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
Jeffrey Eisenhaure, Seok Kim,