Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7176353 | Journal of Materials Processing Technology | 2018 | 6 Pages |
Abstract
A method of lowering the coefficient of thermal expansion (CTE) of a bond metal of sapphire joints was examined for inhibiting the interfacial cracking of joints. An interlayer with the sandwich structure of Zn-Al/(SiCp/A356)/Zn-Al was fabricated and the surface of sapphire blocks was coated with a Zn-Al alloy by assistance of ultrasound. The assembly of sapphire and interlayer was brazed under the action of ultrasound. A metallurgical bond is performed between the sapphire and interlayer, and the composite material of SiCp/A356 is dissolved by Zn-Al alloys during brazing, resulting in a joint consisting of a new composite material of SiCp/Zn-Al-Si. It was composed of Zn-Al-Si alloy matrix and SiC particles with â¼40â¯vol.%, and has a CTE of â¼7.4â¯Ãâ¯10â6 /°C estimated by using Turner's model, approaching that of sapphire (â¼5â¯Ãâ¯10â6 /°C). The maximum shear strength of the composite joints reached â¼155â¯Â±â¯10â¯MPa, an increase of â¼250% in comparison with that joined using the Zn-Al alloys.
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Authors
Cui Wei, Li Shuqi, Yan Jiuchun, Zhang Xing,