| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7176466 | Journal of Materials Processing Technology | 2018 | 6 Pages |
Abstract
The formation of Al/Mg intermetallic compounds (IMCs) of Al3Mg2 and Al12Mg17 was successfully avoided through ultrasonic assisted transient liquid phase bonding Mg/Al using pure Sn interlayers. A new IMC of Mg2Sn formed in the joints. Different bonding parameters were used to control the formation of Mg2Sn. The optimum joint shear strength of 60.0â¯MPa was obtained at the temperature of 220â¯Â°C, ultrasonic power of Mode I and ultrasonic time of 4â¯s. The thickness of Mg2Sn should be depressed to less than 15% of the joint width. Joints were fractured through the Mg2Sn layer.
Related Topics
Physical Sciences and Engineering
Engineering
Industrial and Manufacturing Engineering
Authors
Zhengwei Li, Zhiwu Xu, Dawei Zhu, Zhipeng Ma, Jiuchun Yan,