| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7177035 | Journal of Materials Processing Technology | 2015 | 5 Pages |
Abstract
External high magnetic field (HMF) was used to modify the solidified microstructure and the electrical resistance of both Cu-28Â wt%Ag alloy and Cu-72Â wt%Ag eutectic alloy. The interface scattering model was used to estimate the electrical resistivity of both alloys, considering the effect of HMF on both the solubility of Ag and the microstructure parameters of the alloy. HMF increased the solubility of Ag in proeutectic Cu, thus increased the resistivity. Magnetoresistance (MR) of both alloys was measured in a 31-T resistive high magnetic field. The solidification of both alloys under HMF resulted in increased MR values. Cu-Ag alloy with both high solubility of Ag and high electrical resistivity was found to have high MR.
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Authors
Xiaowei Zuo, Congcong Zhao, Rongmei Niu, Engang Wang, Ke Han,