Coupled annealing temperature and layer thickness effect on strengthening mechanisms of Ti/Ni multilayer thin films

A systematic study was performed on mechanical and microstructural properties of Ti/Ni multilayers with layer thickness from 200 nm to 6 nm and annealing temperature from room temperature to 500 °C. Based on the observed hardness evolution, a coupled layer-thickness and annealing-temperature dependent strengthening mechanism map is proposed. For as-deposited films, the deformation behavior follows the traditional trend of dislocation mediated strengthening to grain boundary mediated softening with decreasing layer thickness. For annealed films, grain boundary relaxation is considered to be the initial strengthening mechanism with higher activation temperature required for thicker layers. Under further annealing, solid solution hardening, intermetallic precipitation hardening, and fully intermixed alloy structure continue to strengthen the thin layered films, while recrystallization and grain-growth lead to the eventual softening of thick layered films. For the films with intermediate layer thickness, a strong orientation dependent hardness behavior is exhibited under high temperature annealing due to mechanism switch from grain growth softening to intermetallic precipitation hardening when changing the loading orientation from perpendicular to parallel to the layer interfaces.