Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7180788 | Precision Engineering | 2015 | 6 Pages |
Abstract
In the electrogenerated chemical polishing (EGCP), material removal rate (MRR) is inversely proportional to the processing gap. To polish a workpiece with a large area, high and uniform MRR is necessary, which prefers a small and uniform processing gap. Based on the principle of the hydrostatic support, a novel micro-gap control method is proposed. The method uniformly controls the gap between the electrode and workpiece to a micro level over a large area. A relationship between the gap size and the inlet pressure is derived theoretically and verified experimentally. The proposed method is successfully applied to the polishing of a Cu surface with a diameter of 50Â mm. Promising results are obtained that surface roughness and flatness are reduced from average roughness (Ra) 82Â nm and peak-to-valley (PV) value 290Â nm to Ra 4Â nm and PV 120Â nm, respectively.
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Authors
Jiqing Cai, Ping Zhou, Renke Kang, Kun Shan, Dongming Guo,