Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7215884 | Composites Science and Technology | 2013 | 7 Pages |
Abstract
Microcapsules filled with epoxy resin were blended into cyanate ester resin to produce systems with low cure temperature and self-healing capacity. A 4,4â²-diaminodiphenylsulfone (DDS) curing agent was adopted for the systems. The mechanical properties, thermal stability and self-healing ability of the system cured at low temperature were investigated. Cyanate ester systems with 2.5 wt% and 5.0 wt% microcapsules (MCs) demonstrated an 11~43% increase in fracture toughness (KIC) relative to the neat resin cured at high temperature, and exhibited slightly lower thermal stability than the neat resin. The self-healing ability of cyanate ester with MCs was influenced by MC content and healing temperature, although for a formulation with 5.0 wt% MCs, recovery of 85% of the original fracture toughness was achieved by heat treatment of fractured samples for 1 h at 220 °C.
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Physical Sciences and Engineering
Engineering
Engineering (General)
Authors
Li Yuan, Sidi Huang, Aijuan Gu, Guozheng Liang, Feng Chen, Yinghui Hu, Steven Nutt,