Article ID Journal Published Year Pages File Type
7217476 Materials & Design 2018 53 Pages PDF
Abstract
A Sn-Ag-Al composite solder alloy reinforced with Mg-MWCNT was found to exhibit higher electrical conductivity, lower density and melting temperature, and better wetting behavior than a Sn-Ag-Al conventional solder alloy. Thus, the Sn-Ag-Al-Mg-MWCNT composite solder bumps were more suitable for interconnection applications than the Sn-Ag-Al conventional solder bumps.183
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Physical Sciences and Engineering Engineering Engineering (General)
Preview
A phenomenological study of a Sn-Ag-Al composite solder reinforced with Mg-MWCNT: Improved electrical conductivity and thermo-physical performance
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