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Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles

Article ID Journal Published Year Pages File Type
7218042 Materials & Design 2016 34 Pages PDF
Keywords
Intermetallic compoundSynchrotronlead-free solderShear strength
Related Topics
Physical Sciences and Engineering Engineering Engineering (General)
Preview
Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles
Authors
M.A.A. Mohd Salleh, S.D. McDonald, C.M. Gourlay, H. Yasuda, K. Nogita,
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Materials & Design
Journal: Materials & Design
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