Article ID Journal Published Year Pages File Type
7219498 Materials & Design 2016 9 Pages PDF
Abstract
Scenario of IMCs formation for Sn-3.0 wt.% Ag-0.5 wt.% Cu-x wt.% NiO nanocomposite solder paste during reflow soldering process.173
Keywords
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Physical Sciences and Engineering Engineering Engineering (General)
Preview
Microstructure and mechanical properties of Pb-free Sn-3.0Ag-0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process
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