3D photonic structure vis-Ã -vis band gap analysis for realisation of spectral beam combination

Analysis of photonic band gap of 3D silicon structure leads to beam combination application is explored in this article. Plane wave expansion method is employed here to investigate the band gap of said structure to envisage the aforementioned application. Simulation upshot revealed that beam combining application relays on the intrinsic parameters (radius of air holes, lattice spacing, nature of material, position and configuration of structure) of photonic structure. Finally, the present work divulges that 3D photonic structure with apposite design parameter can be a good candidate for beam combining application.