Article ID Journal Published Year Pages File Type
726364 Journal of Electrostatics 2006 10 Pages PDF
Abstract
In this paper we describe a 90 nm SOI ESD protection network and design methodology including both device and circuit level characterization data. We compare TLP results of SOI MOSFETs and diodes to bulk devices. We present a new response surface method to optimize device sizes in the ESD networks and show circuit level data comparing TLP test results and SPICE simulation results of an I/O test circuit. We also present product test data for standard ESD stress models.
Related Topics
Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
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