Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
726364 | Journal of Electrostatics | 2006 | 10 Pages |
Abstract
In this paper we describe a 90Â nm SOI ESD protection network and design methodology including both device and circuit level characterization data. We compare TLP results of SOI MOSFETs and diodes to bulk devices. We present a new response surface method to optimize device sizes in the ESD networks and show circuit level data comparing TLP test results and SPICE simulation results of an I/O test circuit. We also present product test data for standard ESD stress models.
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Engineering
Electrical and Electronic Engineering
Authors
Michael G. Khazhinsky, Michael Stockinger, James W. Miller, James C. Weldon,