Study of small holes on monocrystalline silicon cut by WEDM

We studied and analyzed the phenomenon of small holes on the surface of monocrystalline silicon when cut by wire cut EDM. When power density of plasma in the discharge channel reaches a certain value, gasification holes will appear. The influence of small holes on heat transfer process when monocrystalline silicon machined by WEDM was also analyzed, results show that these small holes make the surface heat source change towards body heat source, so thermal stress damage will happen and crack propagation depth increases rapidly when monocrystalline silicon machined by EDM.