Article ID Journal Published Year Pages File Type
726983 Materials Science in Semiconductor Processing 2011 4 Pages PDF
Abstract
Interaction between metallic zinc and Si wafer at moderately high temperatures was found to generate either concave wells or hollow pyramid-shaped protrusions on the (1 0 0) wafer surface. The formation of the wells is attributed to the dissolution of silicon at temperatures much lower than its melting point in the form of Zn-Si eutectic. When the temperature was raised, Zn atoms in the eutectic droplets evaporated and Si atoms in them precipitated accordingly. If a droplet contained plenty of Si atoms, these Si atoms could encounter each other during precipitation at the surface of the droplet and condense into a hollow pyramid-shaped protrusion.
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Physical Sciences and Engineering Engineering Electrical and Electronic Engineering
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