| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 727046 | Materials Science in Semiconductor Processing | 2007 | 5 Pages |
Abstract
In this work, infrared micro-imaging, emission microscope measurements are performed on the chip surface of flip-chip light emitting diodes (FCLEDs). The temperature deviation on the chip surface increases from 19 to 146 °C when the injection current changes from 20 to 2000 mA. When the structure of FCLED is optimized, the temperature deviation becomes smaller. And the thermal resistance is achieved to as low as 10.4 °C/W. The finite element method calculation based on the model of steady-state current field and temperature field is carried out to investigate the effects of current spreading on thermal performance of FCLED.
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Authors
Z.Z. Chen, P. Liu, S.L. Qi, L. Lin, H.P. Pan, Z.X. Qin, T.J. Yu, Z.K. He, G.Y. Zhang,