Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
728440 | Materials Science in Semiconductor Processing | 2014 | 7 Pages |
Abstract
Galvanic corrosion characteristics between poly-Si and tantalum nitride (TaN) in dilute HF solutions (0.1 to 1%) have been investigated. Variables such as poly-Si to TaN area ratio, dissolved oxygen concentration in HF solutions and doping level of poly-Si were investigated. Extent of galvanic corrosion was directly measured as well as estimated using Tafel polarization. Morphological changes on poly-Si due to galvanic corrosion were characterized using Scanning Electron Microscopy. Increase in exposed cathode (TaN) area as well as aeration results in higher corrosion of poly-Si. In de-oxygenated HF solutions (less than 4 ppm of O2), irrespective of the area ratio, there appears to be no significant silicon loss.
Related Topics
Physical Sciences and Engineering
Engineering
Electrical and Electronic Engineering
Authors
R. Govindarajan, M. Keswani, S. Raghavan,