Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
728797 | Materials Science in Semiconductor Processing | 2013 | 5 Pages |
Abstract
Bottom-gate transparent IGZO–TFT had been successfully fabricated at relatively low temperature (200 °C). The devices annealing for 4 h at 200 °C exhibit good electrical properties with saturation mobility of 8.2 cm2V−1s−1, subthreshold swing of 1.0 V/dec and on/off current ratio of 5×106. The results revealed that the stability of TFT devices can be improved remarkably by post-annealing treatment. After applying positive gate bias stress of 20 V for 5000 s, the device annealing for 1 h shows a larger positive Vth shift of 4.7 V. However, the device annealing for 4 h exhibits a much smaller Vth shift of 0.04 V and more stable.
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Authors
Xifeng Li, Enlong Xin, Longlong Chen, Jifeng Shi, Chunya Li, Jianhua Zhang,